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High-Tech: Electronic Product Design Engineering

通过模拟加速智能连接

智能连通性正在将我们的世界从自动驾驶汽车变成工业互联网上的认可。模拟对于使这些技术成为现实至关重要。

从硅到城市的模拟

5 g,自驾车辆、智能产品、家庭52betway.com, cities, and factories to become reality, the enabling electronics technologies must deliver unprecedented levels of reliability. With innumerable sensors, microprocessors, and communication components, engineers face immense product reliability and performance challenges. Engineering simulation plays a critical role in helping high-tech companies deliver innovative and reliable products that achieve and exceed their target performance, energy-efficiency, cost, and speed-to-market goals.

  • Check icon outline
    Optimize Power, Performance and Cost
  • Check icon outline
    Increase Product Reliability
  • Check icon outline
    加速创新
  • Check icon outline
    Optimize Power, Performance and Cost
  • Check icon outline
    Increase Product Reliability
  • Check icon outline
    加速创新
  • Check icon outline
    Optimize Power, Performance and Cost
  • Check icon outline
    Increase Product Reliability
  • Check icon outline
    加速创新
Silicon to the city

必威体育网址ANSYS模拟启用高速高科技创新

必威体育网址ANSYS高科技创新

Win the Race to 5G and Beyond

With quality of service a key metric, engineers face critical challenges ranging from mmWave design to beamforming, MIMO and signal and power integrity. Ansys’ comprehensive multiphysicssolutions are the only way to win the race.

Lead in Digital Transformation, AI/ML and IIoT

当今的智能产品利用人工智能(AI),传感52betway.com器和通信技术来提供舒适,便利和效率。模拟使工程师能够挑战传统的设计智慧并使不可能成为可能。

通过IIT驱动智力和自动化

Multiphysics simulation solutions are critical to accelerate the development of reliable, high-performance, energy-efficient components and systems in the IIoT era.

Engineering Productivity and Innovation

Companies in the high-tech industry must innovate at speed to survive. Simulation led digital transformation enables companies to innovate faster, at lower cost and with fewer resources.

Applications

High tech electronics systems are the backbone for disruptive transformations occurring in industries ranging from mobility to energy, to the fourth industrial revolution and in silico healthcare. Ansys delivers high-tech electronics simulation applications spanning from the scale of silicon in semiconductor design and fabrication, to thermal and electronic reliability in packages and systems to electrically large environments such as cities.

Electric car lithium battery pack and power connections

5G

Engineers use Ansys simulation solutions to develop 5G technologies from devices to networks to data centers. Learn how simulation can help you solve difficult design problems and build your next generation of devices.

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Autonomy

跨部门自动化推动进步,摇来摇去m factory robots to autonomous vehicles to machine learning and artificial intelligence technologies that drive automation itself. See why simulation is critical for autonomous technology to reach its full potential.

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Industrial IoT

物联网改变了我们使用智能设备的生活方式。现在,它正在改变我们制造和生产几乎所有内容的方式。模拟什么连接机器和过程,以基于现实世界数据构建数字双胞胎。

Chip Package

芯片包装系统

必威体育网址ansys’ complete PCB design solution enables you to simulates PCBs, ICs, and packages and accurately evaluate an entire syste

电子产品Reliability

电子产品Reliability

了解ANSYS如何集必威体育网址成电子设备可靠性工具可以帮助您解决最大的热,电气和机械可靠性挑战。

天线设计和放置

天线设计和放置

Electromagnetic simulation of antenna design and its interaction with the entire system enables you to evaluate antenna placement, EMI/co-site interference and more.

Electromagnetic Interference/Compatibility (EMI/EMC)

Electromagnetic Interference/Compatibility (EMI/EMC)

Minimizing electromagnetic interference with simulation delivers high-performance, compliant and safe electronics systems, down to the microchip level.

High-Tech: Innovation at the Speed of Light

This e-book introduces the five critical capabilities required to deliver the new design paradigm supported by real world examples.

transportation ADAS case study

WHEN WORLDS COLLIDE: THE NEW COMPETITIVE BATTLEGROUND.

To capture this opportunity and win the future of the system electronics and semiconductor industry, companies must innovate at the speed of light.

从消费电子到汽车和军事的许多行业都开始设计芯片上的系统(SOC)综合电路,这些电路已根据其自身需求进行了优化。同时,设备设计人员正在将多个芯片集成到一个包装中,以创建更完整,更有能力的解决方案。在这些世界融合在一起的地方,争取市场份额的战争将被赢得并迷失:3D集成电路(3D-IC)。

As connectivity, digitalization and autonomy proliferate, the boundaries between industries are blurring at an unprecedented pace. Promising to unleash $3TN in global technology market spending, the new competitive battleground is to be found where the system electronics and semiconductor worlds collide: The 3D Integrated Circuit System on Chip.

See What Ansys Can Do For You

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